MPI ADVANCED PROBE CARDS

MPi Advanced Probe Cards

MPi Advanced Probe Cards

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Canteliver Probe Card

MPI Cantilever Probe Card is extensively utilized on gold bump and pad wafer screening for Screen driver, logic, and memory system. MPI’s cantilever probes will be the corresponding response on the needs of fi­ne pitch, little pad size, high velocity, a lot less cleansing, multi-DUT, large pin count, and extremely-reduced leakage requirements. With superb craftsmanship, modern architecture and verified methodologies according to mechanical and electrical simulation/measurement success, producing MPI the top cantilever company globally.


FCB Probe Card

The FCB Probe Card is easily the most mature know-how of buckling beam probe card. It's aimed to accomplish the semiconductor ship manufacture time-to-industry (TTM) and value of exam (COT) need. FCB is usually a confirmed Option for a number of semiconductor creation assessments from early engineering pilot-operates to superior quantity manufacturing (HVM). FCB is ready for gadget necessitating significant sign integrity probing (SI) and/or power integrity probing (PI). Applications contain slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB assures the world’s best General Value-of-ownership (COO) for a variety of DUT apps.


EVS Probe Card

The EVS Probe Card is really an enhancement above the conventional buckling beam probe card. Important functions are larger present carrying capacity (C.C.C.) and lessen balanced Make contact with force (BCF), and In general MEMS-like features. EVS can easily fulfill the necessity of Superior wafer probing. Precise alignment and great planarity Management will be the key things contributing to steady contact resistance. With its ability and overall performance, EVS Probe Card is a super choice for Innovative probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Answer to demand from customers for ever finer pitch. It truly is suitable for smaller sized Al pad, which is perfect for tiny pitch application with peripheral and whole array sample. With precise alignment and much better planarity Management, Osprey can arrive at greater productiveness by multi-DUT style and design.  The forming wire (FW) type needle made with MPI’s individual micro fabrication system not only delivers large-high-quality overall performance but in addition makes it possible for quick needle substitution and shortens maintaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which is designed for the demand from customers of small drive probing. In addition it comes along with the opportunity to satisfy higher C.C.C. and higher pin counts application. The MEMS system makes certain hugely regular needle qualities, and also the Unique composition layout enables specific alignment and planarity Handle.


MPI probe card division provides a read more wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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